SPX series of phase change

This material is heat-reinforced polymer, designed to meet the high-end applications, thermal conductivity and reliability requirements. Combined with a small thermal resistance of the channel to achieve the best performance of heat sink, and improved microprocessors, memory modules DC / DC converters and power blocks reliability.
Its phase-change characteristics: solid material at room temperature, and easy to install, for between the heat sink and device. When you reach the product phase change materials soften when the temperature, flow, fill to the device's tiny irregular contact surface. This is entirely filled interface device and heat sink air gap and the gap between the ability to make phase-change pad is superior to non-current elastomer or graphite-based thermal pad, and has a thermal conductivity silicone performance.
Phase-change material is not conductive, but due to phase change materials under high temperature phase transition undergone, it is possible to make metal to metal contact, thus phase-change material can not be used as electrical insulation materials.